Used HYBOND 572A #168272 for sale

HYBOND 572A is a rugged desktop die bonder designed for high-precision, high-efficiency applications. It is engineered to speed up production and to increase throughput. It provides accurate and repeatable placement of die sized from 0.2 mm square up to 10 x 15 mm and also accepts shapes other than standard rectangular dies. The equipment is optimized for high precision with three-axis XYZ control for fast, accurate and repeatable placement. The 5-axis control provides the best positioning accuracy with the ability to address any placement issue or angle requirements. Through its high speed ram with low inertia, 572A offers the ability to adjust placement quickly and repeatedly which greatly increasing throughput and workflow. The system also has a high-resolution linear encoder for precision measurement, as well as a top-down camera that provides repeatable placement and clear real-time vision of die. HYBOND 572A provides efficient die pick-up/release through an integrated miniwafer cassette. This ensures that a high quality bond is maintained and uptime is maximized. This cassette is also designed to ensure compatibility with a variety of miniwafer sizes. Furthermore, it has a patented die attach unit (DAU) to secure the wafer and die during die attach, thus avoiding any possible damage to the die. 572A has various features designed to reduce waste and increase throughput. Its built-in vision registration technology securely positions each die for accurate placement with no initial alignment. The bonder also offers real-time die height measurement with a single die housing (SDH) feature. This allows for placement of multiple die at different heights from one another. In addition, the unit is equipped with a state-of-the-art software machine, to ensure safe and efficient operation of HYBOND 572A bonder. The software controls the operation and enables it to provide detailed productivity reports, security features and detailed process control. 572A is the perfect device for manufacturers looking to increase throughput and strengthen product quality for precision die bonding applications. Its robust design and sophisticated engineering offer a reliable and powerful solution for die bonders with the highest accuracy and speed requirements.