Used HYPERVISION Chip Unzip #199783 for sale

HYPERVISION Chip Unzip
Manufacturer
HYPERVISION
Model
Chip Unzip
ID: 199783
Backside preparation system.
HYPERVISION Chip Unzip (HCU) is a revolutionary new semiconductor device designed to enable the highest-speed and most reliable chip-to-chip data transfer for a wide range of applications. The HCU utilizes next-generation high-speed, low-power polymer metal-oxide semiconductor (PMOS) components to close the gap between chip-to-chip interconnections. With its high-transmission capabilities, the HCU allows for multi-gigabit speeds from chip to chip, reaching speeds up to 16 Gb/s. The HCU is composed of a variety of components designed to provide an efficient and reliable interface. Its design features include: High-speed PMOS - The PMOS components enable high-speed data transfer up to 16 Gb/s. The combination of PMOS and advanced routing technology also enables low-power operation. Reliable cross-talk resistance - To ensure reliable operation, the HCU includes patented circuitry providing low cross-talk at gigabit speeds. Low resistance bonding - The HCU utilizes a unique hybrid process combining charge-based and direct laser die bonding for low resistance, consistent and reliable connections during high-speed operations. Multiple configuration options - The HCU allows for a great degree of configurability and scalability. Through the selection of soft bonding protocols, designers can now tailor their designs to their unique application needs. High reliability - The HCU offers an unprecedented level of reliability, as the circuits are specifically designed to reduce errors and perform consistently. The HCU provides designers with a new solution to interconnecting these chips faster and more reliably than ever before. The combination of high-speed PMOS components and coaxial bonding techniques allows the device to achieve up to 16 Gb/s data transfer rates, and the low resistance bonding provides efficient and reliable low-power operation. The HCU also provides a unique combination of flexibility, scalability, and reliability, allowing designers to tailor their solutions to their unique system needs.
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