Used IMI / INTERNATIONAL MICRO INDUSTRIES SPB 1300E #77530 for sale

ID: 77530
Vintage: 1989
TC Ultrasonic bonder, with Neat X-Y stage 24" x 24" travel, without stepper controls, computer or ultrasonic supply, 1989 vintage.
IMI / INTERNATIONAL MICRO INDUSTRIES SPB 1300E is a low-cost and high-performance automated bonder developed for the bonding of micro-electronic components. With its stiff and dependable twin cam clamp equipment, it can be used for precision assembly processes such as wire bonding, chip-on-board assembly, ball-grid array (BGA) placement and surface mount technology (SMT) work. IMI SPB 1300E offers powerful software that allows for programmable bond parameters and easy library adjustments. It also supports both semi-automatic and manual operation modes. Additionally, the unit features a user-friendly graphical user interface (GUI) which allows operators to quickly understand, operate, and control the machine. Designed for use with a combination of vectors, grid, and manual methods, INTERNATIONAL MICRO INDUSTRIES SPB 1300E supports up to a maximum of 248 bond sites in addition to 16 independently configurable sites. Its heavy duty vertical linear axes offer a large working area of 30cm x 30cm. For precise alignment, the system provides video alignment technology and single X/Y position detection. SPB 1300E is also equipped with an advanced Bond Quality Verification (BQV) unit for proactive reliability assurance. This delivers thorough inspection of each bond and its bond integrity, thus ensuring reliability and optimized production. The unit is compact in design and lightweight, allowing for installation in small areas. Moreover, its auxiliary gripping machine helps to improve the efficiency of the production environment. Furthermore, the machine is equipped with a powerful micro-step motor for precise speed control. This enables precise wire-bonding and precise positioning of components. In conclusion, IMI / INTERNATIONAL MICRO INDUSTRIES SPB 1300E is an extremely efficient and high-performance automated bonder. It is highly suitable for bonding micro-electronic components and can be used in a variety of applications. With its advanced technology, the machine helps to improve production reliability and efficiency while minimizing cost.
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