Used IMI / INTERNATIONAL MICRO INDUSTRIES SPB-TS668HC #9156005 for sale

IMI / INTERNATIONAL MICRO INDUSTRIES SPB-TS668HC bonder is an advanced and reliable automated bonding equipment specifically designed for high current applications. The system features an electrical print station with a hot plate, a green laser marking device, and a fine pitch soldering unit, each controlled by an independent computer. This allows for precise and repeatable results when working with electronics components. The hot plate utilizes a thermally controlled graphite plate surface and features a two-stage heating machine for rapid heating of bonding materials. The laser marking unit is used for marking the bonding pads of components with a barcode. The fine pitch soldering tool strategically and precisely applies fine pitch solder to ensure accurate soldering connections. IMI SPB-TS668HC bonder is mechanically robust with an open access chassis and offers easy access to areas required for servicing and maintenance. The machine features closed motion control loops that ensure repeatable process results. The bonder also includes an integrated vision asset which is used to perform a number of tasks, such as registering components on the printed circuit boards, placing components on the board, and verifying that the solder joints meet the desired quality standards. INTERNATIONAL MICRO INDUSTRIES SPB-TS668HC bonder operates with a mixture of in wet, semi-wet, and dry applications and is capable of accurately and repeatedly applying a variety of materials such as epoxy, silicone adhesives, polyimide coatings, UV resins, and conductive polymers. The bonder is designed to be used in extreme industrial environments as well as for consumer and industrial electronics applications. The robust design of the model with its integrated features enables the equipment to perform and maintain a high level of quality and repeatability. The system also includes software with a graphical user interface that allows for easy setup and control of a wide range of advanced bonding parameters and configurations. In conclusion, SPB-TS668HC bonder is an excellent solution for a wide range of high current applications. The unit is an ideal solution for those who need an advanced level of control in bonder for high accuracy and repeatability. The integrated features and robust design of the machine make it an ideal choice for various applications.