Used INSIDIX TDM #293670540 for sale

INSIDIX TDM (Thermal Direct Mount) is a unique bonding system engineered and manufactured by INSIDIX Inc., a leader in advanced bonding technology. TDM bonding system pioneered a new strategy, which enabled low temperature bonding of die and dielectrics, while achieving a large area coverage and low thermal budget. INSIDIX TDM utilizes a thermo-regulated epoxy base, which is formed into a pre-measured die bonder layer. This layer is then integrated with a design-specific planar metallic bonding structure made from finely microfabricated copper-powder filled thermoplastic adhesive films. Together these components form a complete TDM assembly. The design of INSIDIX TDM assembly offers several advantages to ensure reliable thermal direct bonding of the die and dielectric layer. Firstly, the planar metallic bonding structure ensures low power consumption and uniform heating during the firing process, ensuring a fast and homogeneous direct thermal bonding throughout the entire die and dielectric area. Secondly, TDM structure delivers efficient heat conduction and excellent bonding adhesion, while maintaining a low thermal budget of less than 2 Watts. INSIDIX TDM bonding system offers tremendous benefits compared to other bonding methods. TDM layer is fully compatible with standard manufacturing processes and is suitable for use in virtually all semiconductor device types. Additionally, INSIDIX TDM layer is highly durable and can easily support high-density interconnects on semiconductor devices. The performance of TDM layer is unrivaled. The process is easily automated and requires minimal power consumption. Also, INSIDIX TDM assembly allows for a lower temperature range for the firing process, meaning that the industry-standard 200°C range for the bonding process can be reduced to less than 120°C. This significantly reduces power consumption and eliminates any thermal cycling issues. TDM's efficient use of materials and robust design make it an ideal solution for high-volume production, and its reliability ensures both long cycle-times and high yield rates. As the technology continues to evolve, it is expected that INSIDIX TDM bonder layer will become even more accessible, allowing developers to further improve their products, applications, and processes.