Used JAE / JAPAN AVIATION ELECTRONICS MB 2100 #9290428 for sale

JAE / JAPAN AVIATION ELECTRONICS MB 2100 is a semi-automatic bonder designed for the assembly of high-performance microelectronic components in the consumer electronics and engineering industries. The bonder is capable of handling a variety of PCB sizes, ranging from 12 to 110 mm in length and width. It accommodates up to 8.0mm wire size and can be used to create connection points with a pitch of 0.4mm at temperatures as high as 386 degrees Celsius. JAE MB 2100 is a commercially available bonder with an effective heating range of up to 40 cm and an adjustable distance that can reach up to 800 mm. Its design facilitates quick adjustment of the distance between the heating points, aiding in the speed of the bonding process. This high performance aspect contributes to lower cycle times and higher-quality bonds. The bonder also includes additional features such as an "open terminal detection" equipment to ensure proper contact, a safety checking system to avoid errors, and an "auto bond time setting" unit to optimize the bond time for each substrate. The bonder features a single laser alignment machine for accurate and efficient wire alignment that ensures excellent contact. The display screen shows a variety of parameters including set temperature, set time, actual temperature, actual time, and combined contact force. JAPAN AVIATION ELECTRONICS MB 2100 utilizes an optimized thermal radiation structure with its advanced, low thermal resistance technology, allowing for a warm-up time of only two minutes. It is also equipped with a temperature and heating time memory so that settings can be repeated for the same substrate without needing to reset parameters. In addition, the safety features of MB 2100 include a quadruple safety tool which simultaneously engages a number of sensors and devices to ensure safety. These include a camera vision asset that monitors for defects before the bond process begins and a positioning sensor that monitors for incorrect placement of the substrates. Finally, the bonder is designed to be highly durable and reliable due to its strengthened aluminum frame and stainless steel construction. Overall, JAE / JAPAN AVIATION ELECTRONICS MB 2100 is a low-cost and energy efficient semi-automatic bonder that is capable of handling a variety of PCB sizes. It is equipped with robust safety features, advanced thermal technologies, and a single laser alignment model to ensure accurate and efficient wire alignment. The ability to store and repeat settings for the same substrate further adds to its usefulness, making it an ideal choice for consumer electronics and engineering assembly.