Used JFP MICROTECHNIC WB200 #9217427 for sale

Name: JFP MICROTECHNIC WB200
Brand: JFP MICROTECHNIC
SKU: 9217427
Availability: InStock

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Bonders

Manufacturer

JFP MICROTECHNIC

Model

WB200

ID: 9217427

Semiautomatic wire bonder Ball, wedge & bump Table top machine Bond arm length: 165 mm (6.7") Deep-access bond head Motorized Z bond head: True vertical motion: Z Travel: 40 mm Z Accuracy: 1 µm Motorized: X & Y: 50 x 50 mm X & Y Accuracy: 2 µm Ultrasonic power: 0-2 W / 0-10 W Transducer: WBT140: 62 kHz, 185 mm Long Mouse motion drive Motorized up-down clamp Automatic motorized wire spool, 2" Electronic flame-off Missing ball detection Touch screen interface: 7" Simatic Storage: 50 Programs Programs storage, unlimited on USB Stick Temperature controller integrated Bonding modes: Semi-auto with binocular Full manual Z control with binocular Auto-bond cycle with vertical camera multi-height focus Parameters: Digital programming Programmable bond force I and II: 15-100 cNm Programmable time I and II: 15-5000 msec Programmable power I and II Loop: Reverse + height + length Programmable multi-shape loop per wire Bond: Search height programmable Automatic bond height detection Programmable tail length Wire termination: Table tear / Clamp tear Wedge deep access: 90° Wire feeding Multiple wires: Chain Wire capability: Gold wire: 17-50 µm Aluminium wire: 17-50 µm Ribbon wire: 40-200 µm width (12-25 µm Thick) Heater stage: HP 60-250 X T° Accuracy: +/- 1% Adjustable height Working height: 100 mm Technical data: Ultrasonic system: PLL, 62 kHz Capillary tool: 1,58 mm (1/16") Diameter Current: Maximum 5 A Power: 100 / 240 V, 50-60 Hz.

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JFP MICROTECHNIC WB200 is a state-of-the-art wire bonding system designed to ensure top-level reliability and accuracy in all industrial processes of microelectronic assembly. With its advanced components and user-friendly features, WB200 is a highly versatile and economical solution for the requirements of a variety of applications. JFP MICROTECHNIC WB200 is a semi-automatic wire bonder capable of performing the full range of bonding techniques such as ultra-sonic, thermocompression, thermocompression/ultra-sonic composite, and wedge bonds, among others. The unit is equipped with a two-axis manually operated stage to facilitate precise control and positioning of components for accurate bond placement. The unit's user-friendly interface, along with an intuitive software for controlling the machine, makes it very easy to use. WB200 also performs automatic wire cutting for high accuracy and consistency, and is capable of cutting wires up to 0.25mm in diameter. Moreover, the use of optional automatic wire markers allows for accurate positioning of the wires prior to bonding. JFP MICROTECHNIC WB200 offers many safety features, including physical and electrical shielding and insulated bonding head to reduce the risk of electric shock and contact with hazardous components. Additionally, the wire bonder's thermal bonding feature is designed to reduce the risk of damage to the wire due to excessive heat, while the integrated cooling system helps maintain accurate, consistent and reliable temperatures during bonding operations. WB200 is also equipped with a number of energy saving features, including active process monitoring and automatic power-down features that extend the life of the machine. The wire bonder also comes with an I/O interface for automation and integration with other devices or systems. Overall, JFP MICROTECHNIC WB200 is a high-performance and economical choice for addressing the requirements of a wide range of industrial applications. With its advanced features and user-friendly interface, WB200 is a reliable and cost-effective solution for ensuring top-level accuracy and performance.