Used K&S 1471 #139504 for sale

K&S 1471 is a high-performance thermocompression bonder for use in a variety of bonding applications. This versatile bonder is designed for use with a range of wire bonds and thermocompression bonds, making it ideal for repetitive, high-volume production. The machine can quickly and accurately bond components, such as semiconductor chips, to substrates. 1471 bonder features a high-power source that produces temperatures as high as 650° C in only 10 milliseconds, allowing it to rapidly bond components. Equipped with an advanced thermal system, it offers users very accurate temperature regulation and excellent repeatability. It is also equipped with a range of safety features, such as an overtemperature safety system, to protect personnel and sensitive components from damage. K&S 1471 bonder is easy to operate and offers a range of flexible settings to accommodate different bonding needs. It is capable of bonding many different shapes and sizes of components and its work area is illuminated for easy control and monitoring of the bonding process. It can be programmed to make multiple bonds in succession, with high accuracy and repeatability. Pressure sensors are used to precisely monitor the bond pressure and its momentum system can be programmed to accurately position the components for bonding. In addition to being extremely user-friendly, 1471 bonder is designed to be energy efficient. Its energy consumption is up to 20% lower than similar machines, making it even more efficient to operate. It is light enough to be carried and installed quickly, making it an ideal solution for applications requiring frequent relocation. Overall, K&S 1471 is an advanced, reliable bonder for a wide range of bonding needs. It is easy to operate, energy efficient, and offers users excellent control and repeatability for high-quality bonding results.