Used K&S 1474FP #9266483 for sale

K&S 1474FP is a precision electronic bonder designed for use in a variety of industries requiring fast and accurate bonding of components. The bonder is perfect for tasks ranging from die attach to fine pitch flip chip bonding. It features an innovative design, excellent performance and precision with ease of use and reliable operation. K&S 1474 FP bonder can bond a wide variety of materials, including gold, palladium, aluminum, titanium and copper. It can be easily configured to enable different pitches and bond length, ranging from 0.2mm to 2.0mm. It utilizes an advanced vision equipment that lets the bonder automatically recognize and adjust the parameters appropriate to the part being bonded. The bonder also offers a variety of advanced technological features. It has a 6" LCD touch screen display with an intuitive user interface and built-in diagnostics. 1474FP also utilizes advanced servo controls and a highly responsive, rapid heating system with heat profiles that are customizable to the application. Furthermore, it has the ability to adjust pressure electronically and the capability to program for quick setup. 1474 FP features robust design and reliable operation in order to ensure that it will produce accurate and repeatable bonds. Its steel frame ensures stability and allows for maximum repeatability of the same processing parameters from batch to batch. The bonder also has a self-alignment mechanism for quick and straightforward setup and comes with an in-line vacuum unit for optimal part handling. The high precision and thermal accuracy of the machine also ensures accurate and repeatable results over long production runs. In conclusion, K&S 1474FP is an ideal choice for a variety of bonding applications. Its reliable performance, highly advanced technology and precision make it an invaluable addition to any production process requiring frequent and accurate bonding of different materials.