Used K&S 1484 #130195 for sale

K&S 1484 is a microprocessor-controlled, pneumatic-actuated thermal bonder for the packaging of electronic components and substrates. 1484 was designed for the most challenging packages, such as fine pitch components and ultra thin substrates. The unit is powered by a low-pressure pneumatic equipment to control and regulate the exact temperature and pressure settings for optimal bonding. K&S 1484 is designed with a separate control box, which allows operators to customize temperature profiles and create pulsing profiles for specific application requirements. 1484 is equipped with a heated platform which is capable of reaching a working temperature of up to 345°C (650°F). The unit includes a built-in thermocouple that allows the operator to monitor the temperature. The unit is also equipped with a vacuum arm, which is capable of reaching 110 kPa (16psi) pressure to ensure accurate bonding of the substrates and components. K&S 1484 also features a high-precision force control system that allows operators to customize settings for optimum repeatability and accuracy. The unit's high accuracy ensures that even the tiniest components and substrates can be accurately bonded, assuring superior performance with each package. In addition to its high precision, 1484 is designed to handle large substrates with a capacity of up to 400mm x 400mm (16 in x 16 in) and with a throat depth of up to 5 mm (0.25 in). The unit's compact design and efficient thermal management unit make it an ideal solution for high-volume production. Overall, K&S 1484 is a reliable and high-performance thermal bonder for most challenging electronic packages. The unit provides superior accuracy and repeatability, allowing operators to bond small and large substrates with the highest quality of results. With its intuitive control box, customizable settings, and efficient thermal management machine, 1484 is an ideal solution for high-volume production.