Used K&S 1488L #9287481 for sale
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K&S 1488L is a high-speed bonder designed for industrial use in high-precision microelectronics assembly. It is capable of adjusting the maximum pulse width for direct control over the pulse energy, enabling consistency in energy delivery to any bonding application. K&S 1488 L offers a high frequency for bond preparation, precision control for accurate placement of bonds, and a fast repeat cycle time for high throughput applications. The equipment allows selection between hot-bar or ultrasonic welding techniques with 11 programmable stages, enabling complete control over bonding characteristics, including resistance, temperature, and duration. 1488L utilizes a digital control system to facilitate excellent repeatability and accuracy in bonding. Its thermal control unit has an isolated temperature loop and digital controller to provide precise control over the temperature of the work surface, and the machine's built-in thermal-imaging tool can be used to monitor the temperature of the joint. Additionally, the asset comes with an integrated non-contact active thermocouple for workpiece temperature uniformity. The model also includes a dual-monochromator, enabling variable and precise optical waveform control in the welding process. 1488 L bonder incorporates highly effective safety measures, including an impedance protection circuit to protect against electric shock, and an auto-off feature to shut down the equipment in the event of a disruption in power or process control. Additionally, the system features a built-in compressible aluminum foam, a chemical-resistant coating, and an ESD-safe conductive surface to protect the workpiece from static charges. K&S 1488L provides an exceptional combination of control, accuracy, and safety, making it an ideal choice for high-precision microelectronics assembly applications. Its powerful digital control unit facilitates highly repeatable and accurate bonding, while its comprehensive safety features protect against electrical shock, static charge, and chemical contamination. Its high frequency and rapid cycle times ensure rapid and efficient bonding, making it an essential tool for optimal electronic assembly.
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