Used K&S 472-2 #9314727 for sale

K&S 472-2 is a bonding machine designed for precision operations such as thin film manufacturers, medical device manufacturers, and microelectronic device packaging and assembly. With high pressure and temperature, 472-2 provides an optimal platform for bond interface engineering, facilitating high-reliability bonds for both vapor-phase and thermocompression bonded die, as well as for connectors. K&S 472-2 is specifically designed with extra-precise furnace controllers for accurate temperature control and offers sophisticated control algorithms for quick temperature ramp-up. The machine is equipped with a state-of-the-art bonding head, which has an integrated vision equipment for precise die placement. 472-2 is designed to be easy to use, making it ideal for a wide range of applications. An intuitive graphical user interface enables user-selectable process parameters, and easy-to-use graphical operational report generation. The machine also comes with a range of end effectors, enabling a wide range of compatible materials. In addition to connecting thin film components, K&S 472-2 is capable of cleaning and reflowing soldering of solder on both aluminum and gold bonded substrates, as well as performing fluxless or fluxed soldering with either a fixed height IR (infrared) reflow oven or an adjustable height reflow oven. To ensure temperature uniformity throughout the process, 472-2 has a built-in high-precision uniformity sensor system. This unit offers real-time data displayed on an adjacent monitor, which allows users to make fast and accurate process adjustments for optimal bonding outcomes. The machine is powered by a robust embedded processor, allowing for reliable data transmission and storage, as well as for remote networked data access. The tool also offers high-speed communications, allowing for remote access and operation. K&S 472-2 is a compact, lightweight machine, with easy installation and operator safety features that allow users to operate the asset without the need for additional safety measures. It is also designed to be easy to maintain, minimizing downtime. The machine also has a low price tag for its features, making it an attractive choice for bonder applications in microelectronics.