Used K&S 6100 #9363104 for sale

K&S 6100 is an advanced automated wafer bonding equipment designed for a range of bond processes in the semiconductor industry. Designed to handle up to eight wafers at a time, 6100 includes state-of-the-art precision leveler capabilities, advanced wafer-handling motion systems, and a high-performance imaging system. K&S 6100 is equipped with a precision leveler stage. This provides tilt and twist adjustments to the attitude of each wafer, enabling precise alignment of the wafers relative to each other — even with non-uniform wafer dimensions — and reducing the need for manual intervention. It offers control of pitch, roll, and yaw, as well as an active heave compensation unit. 6100 also includes a high temperature process chamber filled with a nitrogen/oxygen atmosphere. This chamber provides an ideal environment for bond processes such as anodic, eutectic, and thermocompression bonding. With this machine, users can perform high temperature processes up to 850°C. A built-in vision tool simplifies alignment allowing accurate placement of bond sites. K&S 6100 offer a variety of automation options for increased throughput and productivity. Users can execute up to two bond processes in tandem or in parallel, with options for multiple or rapid bond sites. The automated wafer handling software also allows for manual placement of wafers onto the bonding site. Finally, 6100 includes a variety of safety and calibration features. This includes a variety of safety interlocks to protect users and components from unplanned events, as well as specialized wafer and bond interface calibration routines. In short, K&S 6100 is an automated wafer bonding asset designed to streamline the process of performing the advanced bond processes used in the semiconductor industry. The model features a precision leveler stage, a high-temperature process chamber, and various automation features for increased throughput and safety.