Used K&S 8020 #9105808 for sale

K&S 8020 is an efficient and cost-effective high- performance adhesive. This dual-cure structure is designed to run on a conveyor system and bonds substrates to thicknesses in excess of 0.03" (0.76 mm). The dual-cure structure allows for thermal curing of the adhesive in a much shorter time frame compared to traditional output methods. 8020 has an easy-to-use touch screen display that allows users to easily adjust temperature, pressure, speed and other parameters. K&S 8020 offers a unique advantage over other thermal bonding machines in that its nozzle technology is designed to distribute adhesive with a consistent and even flow. The nozzle opening is positioned close to the substrate to ensure precise and accurate adhesive patterns. The generator in the machine is of a digital design and allows adjustable and precise settings for different substrates and conditions. The generator is adjustable by either the user or a service technician in order to control the output of the adhesive, be it a light or a heavy bead. 8020 features a sloped profile design which ensures that the adhesive is metered out and evenly distributed across the entire surface of the substrate. The sloped profile also reduces the distance between the substrate and the nozzle so that the adhesive is applied closer to the surface, resulting in a more uniform pattern and stronger bond. The sloped profile also allows for a rapid and efficient cooling of the adhesive once it is applied which ensures a higher throughput and quicker production cycles. K&S 8020 also offers an optional cooling unit integrated into the machine which assists with cooling the adhesive quickly and evenly, allowing the bond to form quickly and efficiently. The cooling process helps to create a stronger bond and allows for the substrate to be removed from the press sooner. The unit is adjustable and features multiple temperature settings which can be adjusted to match the material and bond being made. 8020 is a cost-effective choice for converting and bonding operations. Its dual-cure technology ensures faster cure times and improved heat distribution than much of the competition, while its adjustable settings and integrated cooling unit allows for precision and fine-tuning of the bond properties. With a high-performance adhesive and a easy-to-use interface, K&S 8020 is an excellent choice for quick set-up and versatile bonding jobs.