Used K&S 8028S #9311445 for sale

Manufacturer
K&S
Model
8028S
ID: 9311445
Vintage: 2000
Wire bonder 2000 vintage.
K&S 8028S is a high-precision lead-free bonder designed for production of microelectronics. This advanced machine is capable of delivering very precise microbonding operations with excellent repeatability. It offers both thermal and ultrasonic bonder technologies. K&S 8028-S can bond either gold, copper, and aluminum wire bonding. It has a high-speed motor-driven collet for wire diameter and efficient, programmable wire feeds for up to eight different wires. 8028 S can be used as a bonder for a variety of microelectronics, such as microprocessor boards, integrated circuits, discrete components, SMT components, sensors, pluggable connectors, etc. Its advanced technologies and options guarantee a reliable and consistent bonding process. It features an electronic motor control equipment, which ensures accuracy, consistency, and repeatability throughout the entire process. The machine is also equipped with built-in safety features, such as ESD (electrostatic discharge) protection, to protect its delicate electronic components. 8028-S bonder offers cutting-edge features for increased efficiency and productivity. These include a pulse control system for improved control of the bond speed. It also utilizes a high-contrast optical unit for precise alignment and tie-in. The machine utilizes a semi-automatic bonding process that ensures every bond is made consistently and accurately. K&S 8028 S is easy to use and maintain. It is designed to be user-friendly, and offers advanced features to simplify the setup and operation. It comes with an application editor that offers a variety of wire programs that can be easily selected and operated. The machine also includes a built-in fault-detection machine that runs in the background, eliminating the need for manual monitoring. 8028S is an ideal choice for a variety of microelectronic applications. This advanced, user-friendly machine offers excellent repeatability, fast operation, and reliable performance. It is suitable for mass production of microelectronics and provides a cost-effective, reliable solution for high-precision bonding.
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