Used K&S 8028SG #9208424 for sale

K&S 8028SG is a high-performance automated bonder that is designed for use in semiconductor packaging and wire bonding industries. It is ideal for industrial environments as it offers high levels of accuracy and throughput. The machine has a compact footprint, allowing it to fit into tight spaces without sacrificing performance. K&S 8028 SG is equipped with high-efficiency wire bonding features, providing users with an ideal solution for attaching wire to die pads or other components. It is capable of providing wire bonds with up to 190N bond force and has a bonding rate of up to 10,500 bonds per hour when using ball pull down bonding techniques. The machine is capable of bonding both aluminum and copper wire to gold die pads. The bonder is constructed from durable materials that meet the highest industrial standards. It features a heavy-duty frame to ensure a stable platform and precision tooling for a secure, accurate and consistent bonding process. The bonding head has integrated temperature compensation and is equipped with an overload protection feature to prevent damage from exceeding recommended wire tension. 8028SG is designed to be easily operated, featuring a user-friendly control panel with quick-access controls and an intuitive graphical interface. It is equipped with an advanced diagnostics system that enables operators to detect any potential issues quickly and take corrective action. The machine's design also incorporates air cooling and filtrations systems for a long, reliable operating life. 8028 SG is a reliable, high-performance automated bonder capable of delivering fast, accurate results in challenging industrial environments. With its compact footprint and robust construction, it provides operators with a simple, reliable solution for wire bond processes.