Used K&S 8028SG #9386988 for sale

K&S 8028SG is an advanced pressure-eutectic bonder for attaching gold wires to semiconductor devices. This bonder utilizes a revolutionary eutectic bonding process using an ultra-precision gold-wire bonding head and a hydride gas atomizer. K&S 8028 SG employs an advanced micro-processor control interface to maintain precise control of the parameters and ensure optimal bonding results. The high-performance gold-wire bonding head is designed to deliver extremely accurate and reliable bonding processes with minimal waste. With a bonding surface area of up to 135µm, the gold-wire bonding head is capable of precision gold-wire bonds with virtually perfect metallurgical quality, while remaining highly cost-effective. Furthermore, the gold-wire bonding head is equipped with an advanced integrated heating equipment that can heat the gold wire at the pre-set target temperature with a programmable temperature profile. In addition, 8028SG has a power-regulated hydride gas atomizer to produce extremely-fine particles of gold powder for a eutectic bonding process. The atomizer is designed to convert hydride gas into aerosolized particles with a controlled size distribution in the range of 0.1 -40 microns. This provides uniform coverage and excellent adhesion between the gold wire and the wire bond pads. The robust control system of 8028 SG allows the user to obtain optimal bond parameters for all bonding processes. It includes a multi-stage programmable control unit which can be programmed to monitor and release the gold wire and perform metallurgical bonds with precise power and time control. Moreover, the machine is capable of delivering feedback information regarding the real-time bond conditions. In conclusion, K&S 8028SG is an advanced bonder for gold wire attachment. This machine is equipped with a revolutionary eutectic bonding process, an advanced gold-wire bonding head and an integrated hydride gas atomizer. It has a powerful and robust control tool that can be used to precisely monitor and manage the gold wire attachment processes to obtain the best bond parameters. As a result, K&S 8028 SG is a reliable and cost-effective bonder for attaching gold wires to semiconductor devices.