Used K&S 8060 #9208720 for sale

K&S 8060 is a fully automated micro-bonder designed to offer accurate and reproducible, low-temperature wire bonding. With a controller comprising of user-friendly software, 8060 presents a fast and efficient way to produce interconnects between devices on a semiconductor package substrate. K&S 8060 is capable of handling various packaged substrate sizes up to 200mm x 200mm. Utilising fully compatible feeders, 8060 can accommodate specified materials for the package including wire, epoxy, ribbon, and chip carriers, as well as bonding tools. It also offers temperature monitoring and control throughout the bonding process. K&S 8060 is designed for operation at a controlled bond temperature, guaranteeing an optimal bond. Due to its design, 8060 has the ability to reduce the likelihood of the bonding wire being contaminated with metals, resulting in improved electric performance. Additionally, K&S 8060 also possesses fantastic manoeuvrability with precision interconnects and precision ball bonds. 8060 is a highly efficient user-friendly platform, as its software can be programmed for each individualprocess based on user preferences and configurations. Furthermore, the controller displays updates in real-time, minimising downtime and allowing users to monitor the entire process in detail. It has a built-in auxiliary vacuum block with an auto-load/unload system, allowing for flexible operation in the transfer process. It also offers a number of safety features to ensure a safe and uninterrupted operation. For example, it has an emergency stop button, static power deprivation and a keypad lock mechanism. K&S 8060 has an advanced vision system which detects missing or missing bonded balls automatically, thus avoiding any operation errors. It also features a bonding force control for the bonding force range, which helps prevent damage to the die of the semiconductor package. Furthermore, its auto-calibration feature allows the device to optimise its motion path automatically. To sum up, 8060 is a sophisticated, advanced micro-bonder that provides users with a fast, precise and automated way to produce interconnects between devices on a semiconductor package substrate. Its user-friendly software, temperature control and safety features, as well as its advanced vision system make it ideal for a variety of bonding applications.