Used K&S 8060 #9258483 for sale

K&S 8060 is a low temperature thermal bonding tool designed for use in soldering, desoldering and rework applications. This tool is designed to provide superior accuracy and performance in high-reliability electronics bonding operations. Its unique design utilizes a removable heating element that can be adjusted to a range of temperatures so that it can be used for any soldering application. 8060 is capable of solderless joining of components and substrates with precise control over the thermal transfer from the bonding tip. The tip is connected to a precise stepper motor-driven element that ensures consistent and accurate movement, allowing for a repeatable and reliable bond process. This product utilizes a unique element and design to ensure that the bonding process is uniform and free of any thermal fluctuation. The bonding tip is made from a high-temperature ceramic material that ensures consistent heat dissipation for uniform heating of components or substrates. This feature eliminates any chance of thermal runaway and ensures that the desired temperature is maintained throughout the whole process. K&S 8060 is operational with a temperature range of 200°C to 500°C, making it suitable for a variety of needs. The tool comes equipped with an LCD display that allows you to monitor the temperature of the element in real time and make any adjustments necessary. This makes it easy to accurately dial in the precise temperature setting for specific applications. It also has a built-in timer that allows you to set a specific time for the bonding process to complete. 8060 is equipped with a variety of safety features, such as a low-temperature auto-shut off and a grounding hook that ensures a secure connection between the tool and a ground connection. This product is designed to protect the user from any potential safety hazards. K&S 8060 is a reliable and efficient tool for performing any solderless thermal bonding operation. It offers a range of sophisticated features perfect for facilitating a successful and secure bond process.