Used K&S AT Premier Plus #293629631 for sale

K&S AT Premier Plus is a high-performance bonder designed for bonding critical substrates in a variety of processes. It features an advanced process control equipment and cutting-edge technologies to deliver superior performance. The bonder also features an efficient power management system that saves energy and reduces costs. AT Premier Plus has an industry-leading process control unit. This machine precisely measures, monitors, and delivers accurate metallization thickness, pulse time, and temperature. The process parameters can be easily adjusted and monitored for optimal performance. This ensures consistent bonding performance and quality. The tool also records process data to provide detailed reports and analysis of the bonding process. The bonder is equipped with a high-power, multi-spectrum light source that allows for accurate pulse time control. The pulse time settings are adjustable and automatically adjusted to optimize process performance and reduce the likelihood of damage to delicate substrates. The control asset also allows for multiple parameters to be monitored in real-time for improved process consistency and performance. The power management model of K&S AT Premier Plus is designed to reduce energy costs and ensure optimal performance. The equipment automatically adjusts the power output to match the process parameters. This provides maximum efficiency and reduces energy use. The system also features a voltage regulation unit that provides improved surge protection and prevents premature bonding failure. AT Premier Plus also features a reliable safety machine. The safety tool includes pressure sensors and an overflow protection asset. The density sensors ensure that the proper pressure is applied during bonding, while the overflow protection model prevents any excess or hazardous materials from reaching the substrate. These features help to ensure the safety of the personnel and the process environment. In conclusion, K&S AT Premier Plus is an advanced bonder designed for critical bonding applications. It features a process control equipment that monitors and adjusts metallization thickness, pulse time, and temperature. It also has a power management system for increased energy efficiency and a reliable safety unit for improved safety. The bonder is designed to provide superior performance and consistent bonding results.