Used K&S AT Premier Plus #9254100 for sale

Manufacturer
K&S
Model
AT Premier Plus
ID: 9254100
Vintage: 2017
Ball stud bumper Copper wire Chuck, 8" OCR and camera included Accubump installed Bump size: Minimum: 1.4 Times wire diameter, 17.5 μm minimum Maximum: 3 Times wire diameter Minimum bond pad pitch 50 μm Wafer level bonder Upper XY table with direct voice coil drive for bond head travel Lower XY table with stepper drive for work holder travel (200 mm / 300 mm) Vision system with high / Low mag optics and lighting assembly Battery back-up for graceful shutdown algorithm LCD Monitor, 17" Part number / Description 03690-0903-100-08 / ATPP Adaptable, 8" 08838-0850-000-03 / Cu capability hardware kit 08838-0851-000-01 / Dual EFO assembly kits 08838-0903-000-00 / Red / Blue oblique illumination kit ATPP 08888-8200-009-00 / ATPP Wafer level copper support 08888-0962-000-00 / PFK Kit 2017 vintage.
K&S AT Premier Plus is a high quality bonder manufactured by K&S Technology Corporation. This advanced bonder is designed for superior performance, offering state-of-the-art performance in electronic assembly, manufacturing, and repair applications. AT Premier Plus bonder features a highly efficient design that maximizes throughput and minimizes downtime. K&S AT Premier Plus is a two-part delivery equipment which consists of an upper layer emitter and a lower layer receiver. The layer emitter has a dielectric field which applies an electrostatic field allowing for higher precision than other standard bonders. Additionally, the emitter's design actively accelerates bonding speed, helping improve overall efficiency. The lower layer receiver component of AT Premier Plus system is designed to handle higher current and heat than other systems, providing accurate results regardless of the type of bond being used. The receiver also features an insulated design that prevents accidental contact and short circuits from occurring. K&S AT Premier Plus unit comes with several features that make it particularly advantageous for electronic assembly. It offers a high level of temperature control, allowing users to adjust parameters to meet specific needs. This makes it an ideal machine for precision applications. Additionally, AT Premier Plus uses variable amplitude waveforms for optimal performance, allowing for more accurate and precise configuration. Additionally, it has a two-stage curing process which helps ensure complete curing and no discoloration. K&S AT Premier Plus tool has a variety of accessories available, increasing the range of uses. These include an additional preheater which boosts performance and reliability, an optional grounding station that minimizes uncontrolled electrical discharge, and a choice of alignment jigs for more accurate alignment. For users wishing to improve their performance, AT Premier Plus is fully upgradeable. K&S AT Premier Plus asset offers the latest software and hardware advances, and can be operated with up to four different sets of settings. Overall, AT Premier Plus is a powerful and versatile bonder that offers superior performance, reliability, and versatility. It is well suited for a wide range of electronic assembly, manufacturing, and repair applications. With its advanced design and range of features, K&S AT Premier Plus provides a cost effective solution for improved productivity, accuracy, and quality.
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