Used K&S AT Premier #293625584 for sale

Manufacturer
K&S
Model
AT Premier
ID: 293625584
Ball stud bumper.
K&S AT Premier Bonders are high-precision, automated thermal bonding systems designed for use in the electronic assembly industry. These bonders offer a fully automated equipment that provides robust bonding and sealing technologies with precise control over a range of temperatures and applications. The Premier Bonders employ multiple heating technologies to achieve the desired bonding results. The bonding chamber houses a hot plate for full coverage for larger components and a soldering gun for pinpoint accuracy for small components. The hot plate design ensures a uniform and consistent bonding temperature throughout the work zone. The soldering gun provides precise directed heating with precise temperature control. AT Premier Bonders also provide an interlocking safety system. The integrated safety unit includes active light curtains to guard against accidents or unexpected product movement during the bonding process. Additionally, all hazardous points of operation are shielded to prevent burns and other injuries. The machine also features active diagnostics that monitor the process and alert in the case of errors or alarms. The hand-held controller equipped with the Premier Bonders contains the user interface, providing real-time feedback and precise control of the bonding process. An intuitive touch screen menu allows for easy access to all the panels and settings required for the various bonding applications. The controller also features a graphical programming language to enable custom programs and bonding profiles. K&S AT Premier Bonders provide a reliable and cost-effective solution for a variety of thermal bonding applications. With its precise control features and powerful safety features, the Premier Bonders ensure uniform and high-quality bonds. Additionally, the intuitive touch screen interface makes setup and operation of the bonding process easy and effortless. This makes AT Premier Bonders an ideal choice for anyone looking to optimize their electronic assembly process.
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