Used K&S ConnX-LED Plus #9218143 for sale

K&S ConnX-LED Plus is a technological advancement in the world of bonders. It is a high-performance, easy-to-use, precision bonder designed to fulfill a variety of wire bonding applications such as ball/wedge bonding, ribbon bonding, gold-to-gold bonding, and others. The quality of its microprocessor-controlled motors and closed-loop feedback system allow the user to accurately and consistently bond on even the most demanding jobs. ConnX-LED Plus offers a wide range of capabilities such as automatic filament wire feed, closed loop wire placement, high speed bonding, bonding area detection, and more. At its core is a high-resolution LED microscope that is used to monitor the bond process, providing an accurate depiction of the bonding area to enable a high degree of precision and control. Additionally, K&S ConnX-LED Plus features a range of adjustable parameters, such as bond speed, signal intensity, and welding length. This makes it highly customizable to meet specific application requirements. ConnX-LED Plus is constructed with an advanced cooling system to prevent over-heating, while its durable construction ensures long-term reliability and accuracy. It is also designed to be safe and user-friendly, with safety features such as a safety guard and emergency shut-off switch, while its intuitive interface is easy to use and navigate. The bonder also comes with an optional programmable logic controller (PLC), which provides a greater degree of control over the bond parameters for specialized job requirements. For utmost reliability and performance, it is essential to maintain K&S ConnX-LED Plus in optimal condition. To this end, it requires regular inspections and preventive maintenance, such as cleaning the LED microscope lens and lubrication of all moving parts. These activities should be performed at the manufacturer-recommended intervals. ConnX-LED Plus is an excellent choice for high-precision wire bonding on a wide variety of applications. Its robustness, reliability, and user-friendly design make it a preferable solution for a variety of bonding requirements.