Used K&S ConnX-LED Plus #9218148 for sale

K&S ConnX-LED Plus is a state-of-the-art thermocompression bonder designed to meet a wide range of application requirements. The machine is capable of thermocompression bonding (TCB) and provides a significant improvement in bond accuracy, repeatability, and throughput. ConnX-LED Plus features two thermocompression bond heads to accommodate large numbers of interconnections. This equipment is a fully featured, high performance solution for all assembly and bonding applications. The unit operates with a single, high-efficiency bond head which has adjustable speed, width, and height parameters to achieve the best bond gap performance. A touch screen LCD panel with intuitive graphical user interface makes operation and maintenance easy. The LED Plus also features real-time temperature display and a vacuum assisted bonding system to ensure an accurate bond. K&S ConnX-LED Plus accommodates a wide range of substrates. It has a heated top plate which helps to prevent material shrinkage and deformation. The uniform temperature distribution across the base plate helps to optimize part placement and balance the preheat process. It has an advanced low heat build-up feature that gently controls temperature without sacrificing the contact temperature needed for successful thermocompression bonding. The unit is powered by 220VAC, 50/60Hz and includes a safety interlock to ensure safe operation. The unit features a durable and lightweight construction and is designed to handle a wide range of substrates and bonding needs. It has a process chamber that uses an interactive gas distribution hood which helps to guarantee a consistently uniform temperature distribution. The BondPlus software is included with the machine to increase functionality and provide a graphical interface for easy programming and data management. The software is easy to use and provides direct real-time control over the thermocompression process. ConnX-LED Plus is a great choice for production, small labs, and research environments that require precision thermocompression bonding. By utilizing its advanced features and robust design, it can help minimize errors, improve process repeatability, and reduce cycle time.