Used K&S ConnX Plus #293804965 for sale

K&S ConnX Plus is a revolutionary semiconductor-level bonder for die-to-die bonding, wire bonding, and die attach applications. This high-performance bonder is capable of achieving precision and repeatability for each of these processes. Utilizing a high-speed planar drive system, ConnX Plus is able to quickly and accurately align die or other components with respect to each other or to the substrate. The system's mechanical structure is designed to provide minimal vibration which ensures precise placement of the dies and other components. In addition, the bonder's motion control system provides precise positional accuracy and repeatability. For die-to-die bonding,K&S ConnX Plus offers a wide range of bonding processes, including gold and copper wire bonding, and wedge and studbump bonding. Wire bonding enables the connection of dies and other components on a substrate via gold or copper bond wires. With wedge bonding, ConnX Plus can bond the dies together with a wedge bond head, forming a mechanical and electrical connection between them. The studbump bonding process, on the other hand, uses a high-frequency capacitance coupled process to create a permanent connection between two dies. For die attach applications, K&S ConnX Plus offers a choice of dispensing or printing methods, with both manual and automatic options. In the printing method, a conductive paste is dispensed through a jet nozzle onto the substrate, while with the dispensing process, a highly viscous material is ejected from a nozzle. Both the manual and automatic processes offer precise placement of the die onto the substrate. Overall, ConnX Plus is a precision bonder that provides high accuracy and repeatability for die-to-die bonding, wire bonding, and die attach applications. With its sophisticated features and reliable performance, this bonder can provide a dependable and cost-effective solution for any semiconductor-level bonding operation.