Used K&S ConnX #9384510 for sale

K&S ConnX is an advanced bonder that combines precision and performance for a variety of automated needs. It is capable of quickly and reliably producing secure, durable, and highly-controlled bonding results for a variety of substrates. ConnX is a digital machine that utilizes high-precision digital vision for compensation and control. With this technology, the bonder is able to accurately align and adjust the placement and properties of the substantially overlapping components that make up the bond, providing steady results. K&S ConnX also features an intuitive touch screen interface with 24 different languages that make it easy to program and control the bonder, streamlining the bonding procedure. Moreover, ConnX includes specific Bond Consistency Monitoring technology, which ensures that each bond performs as expected, as well as Opto-Scan technology for checking parts during production and also for further quality assurance. This technology measures the offset and elevation of the components, making sure that the bond is applied correctly. K&S ConnX is also able to maintain a consistent bond force, temperature, and pressure throughout the entire bonding process. Users can select the parameters they desire and the machine will adjust the bonder's parameters accordingly, ensuring that the unit is always producing dependable and reliable results. Furthermore, ConnX is also equipped with an active fluxing equipment and a no-clean flux residue removal system. The fluxing unit can maintain a consistent pot life and dispersal pattern when used with compatible fluxes and also improve the efficiency of the bonding process. The no-clean flux residue removal machine ensures that no particles are left behind and all surfaces are clean and ready for further processing. K&S ConnX is the ideal choice for achieving consistent and reliable results in a variety of automated needs. Its highly-precise capabilities, along with its user-friendly interface, make it an ideal choice for manufacturers looking for an automated and streamlined bonding process.