Used K&S IConn LA #9263234 for sale

K&S IConn LA is a superior one-component, light curing, die attach adhesive developed by Kester. It is an optically clear, low viscosity adhesive designed to provide superior bond strength between metals, ceramics, and other industrial substrates. It is an extremely fast and reliable adhesive for applications that require bonding both heat and moisture sensitive materials. When exposed to visible light, IConn LA quickly transitions from a liquid state to a cured solid. It is formulated for extremely short curing times with minimal impact to the neighboring components during the curing process. It is thermally and electrically conductive and offers excellent environmental resistance as well as superior adhesion to various substrates. The adhesive is particularly well suited for surface mount device die attach applications due to its stream-lined processing flow. This includes automated or hand dispensed processes, as well as vertical dip-bonding. It is an ideal choice for traditional leadless packages such as chip carriers, flatpacks, and BGA's. The curing of K&S IConn LA begins with the initial exposure to light. As the light intensity increases or decreases, the curing time (tack-free time) will be affected. The higher the light intensity, the faster the curing time. Post curing can be increased by subjecting the material to light between 100-300 mW/cm2 for several seconds to several minutes, depending on the substrate and joint configuration. In addition to the lightfast curing process, IConn LA has an extraordinarily low cure shrinkage, reducing stress at the bondline. This low shrinkage also ensures tight adhesion between the bond line and top surface of the component. The adhesive can also be dispensed with precision and provides excellent die protection against shock, vibration, and assembly processes that work with a variety of die sizes. K&S IConn LA also has a pot life of six months and a shelf life of one year, making it a cost-effective and reliable choice for both small and large volume applications. Its low temperature curing and superior bond strength make it well suited for many industrial and medical applications. In conclusion, IConn LA is an optically clear and low viscosity bonder that provides high quality performance for surface mount device die attach applications. With its ability to cure quickly and its low shrinkage properties, it is an ideal choice for those high-speed production demands. Its excellent environmental resistance and low temperature curing makes it a safe and reliable choice for many industries.