Used K&S IConn Plus #293600200 for sale

K&S IConn Plus is a lightweight, easy to use and versatile micro bonding station. It is designed for precision alignment and bonding of small components, such as microelectronic components and semiconductors. The bonder sets up and maintains a bond process, ensuring high product yield and improved efficiency in the production process. IConn Plus utilizes dual coaxial cables and a special bonding head to ensure accurate alignment along two axes for the strongest possible bond. The coaxial cables direct K&S IConn Plus bond head to the exact spot where it is needed, with no misalignment or errors. This is key to the success of all micro bonding operations, as it ensures perfect alignment every time. With this ideal alignment, IConn Plus can create tight, secure bonds that won't break, even in the most extreme conditions. K&S IConn Plus is a heater-based, single-phase bonder that is adapted to industry standard and user-defined parameters for optimal control of the bond and process times. IConn Plus GPD (Graphite Pattern Dispensing) feature is a particularly advanced and efficient feature of K&S IConn Plus, providing increased selection, control and accuracy of dispense patterns and other pressure settings. The GPD feature is also adjustable to meet different material requirements, and provides an optimal mechanical connection with very low levels of electrical leakage. IConn Plus also has an easy-to-use interface, allowing users to assign process parameters and customize their bond process. The interface is designed to make it simple to enter and save the parameters according to user's preferences, allowing them to quickly and easily generate repeatable, reliable and quality bonds. Furthermore, all process parameters are stored in K&S IConn Plus internal memory for future reference. With its capacity for real-time process monitoring and user-defined optimization, IConn Plus simplifies and increases the success rate of complex process. Overall, K&S IConn Plus delivers improved product yield, lower costs, and faster processing all at once.