Used K&S IConn Plus #293634695 for sale

Manufacturer
K&S
Model
IConn Plus
ID: 293634695
Vintage: 2018
Wire bonder 2018 vintage.
K&S IConn Plus is a revolutionary bonder designed to provide superior processing performance when bonding component packages such as ball grid array (BGA) and chip scale packages. Using advanced techniques such as localized pressure, non-contact ultrasonic activation and air-knife cooling, IConn Plus enables users to precisely and accurately solder component packages in a variety of applications. K&S IConn Plus features an integrated high-frequency soldering head that is capable of heating component packages to over 400°C in just seconds to ensure reliable soldering. For even greater performance, the device includes a powerful vibration damping structure which helps to reduce component movements and results in superior soldering quality. In addition, IConn Plus also includes an innovative tooling package which helps to ensure an optimal bond formation between component packages and the substrate. K&S unique design includes the Flexible-tooling Equipment (FTS) which allows users to quickly and easily modify the tooling package to suit different component packages and their respective layout on the substrate. In addition to providing superior soldering quality, the tooling package also reduces the risk of bridging and short-circuiting during soldering. K&S IConn Plus also features a high-temperature substrate transport system which enables users to quickly move component packages for loading and unloading. This unit can help to reduce the cycle times when bonding component packages- making it ideal for high-speed applications. To ensure the most accurate soldering results, K&S has incorporated its highly acclaimed software, which features sophisticated temperature control and soldering parameter settings. This enables users to program the device for different component packages and substrates and ensure that the soldering is completed under optimal conditions. In summary, IConn Plus is an advanced bonder that enables users to quickly and accurately solder a wide range of component packages. Using innovative features such as the Flexible-tooling Machine, advanced software and a high-temperature substrate transport tool, K&S IConn Plus delivers superior soldering performance and flexible operation for many applications.
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