Used K&S IConn Plus #9223150 for sale

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Manufacturer
K&S
Model
IConn Plus
ID: 9223150
Vintage: 2015
Wire bonder 2015 vintage.
K&S IConn Plus is an advanced desktop bonder which is specifically designed for Microelectronics applications, including Wire Bonding and general Rework processes. This reliable, cost-efficient bonder is capable of producing a wide variety of products such as custom packages, medical and automotive electronics, LED displays, and more. IConn Plus is a compact, easy-to-use tool that provides unparalleled performance in a small space. This includes a 9-axis robot used ten times faster than a human hand, which is able to move rapidly for high performance bonding and rework processes. Its laser head is capable of extremely precise bonding. In addition, its intuitive user interface allows the operator to monitor the job and adjust parameters to suit the requirements of the customer. K&S IConn Plus also offers excellent safety features, enabling users to work in a safe and secure environment. It has a safety enclosure that prevents debris, splatters and flying objects from entering the work space. An air-blast system also helps to cool the workpiece while performing bonding tasks, thus ensuring a safe working environment. IConn Plus offers a wide range of features and benefits that make it one of the most reliable bonding equipment on the market. In addition to its precise and rapid capabilities, its 20 megapixel camera can be used for viewing purposes, while its powerful 3D vision system provides intuitive and precise feedback on the progress of a job. The bonder also features an integrated robot-vision based wire feeder capability, and is equipped a bonded pad-to-pad controller to ensure precise and consistent results. For those looking for an easy-to-use and cost-efficient bonding solution, K&S IConn Plus is the bonder of choice. Its advanced features, safety specifications, and reliable operation make it an ideal choice for any type of Microelectronics applications. This bonder allows for increased efficiency in any process by making rework and bonding operations easier and more accurate than ever before.
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