Used K&S IConn ProCu Plus #293631979 for sale

K&S IConn ProCu Plus is an advanced, high-performance bonder designed to meet the needs of production-level semiconductor and other device assembly. The device is designed to provide maximum accuracy and repeatability while minimizing down-time and defect levels. IConn ProCu Plus features a low-pressure, low-temperature bonding process that eliminates the need for excessive heating of the bonding surface. This ensures that the device can bond materials evenly and with minimal distortion. The device also has a high-speed capability, allowing for multiple bonding operations to be performed simultaneously. The bonder also boasts a low defect rate, allowing for high-yield production runs. K&S IConn ProCu Plus is designed with a state-of-the-art, precision-machined platform that allows it to achieve excellent accuracy and repeatability. The bonder's vacuum assembly enables the creation of a clean, reliable bond. It also has adjustable pressure and pre-set temperature settings that make it easy to achieve consistent bonding results. IConn ProCu Plus also has several safety features to protect against damage to the device. These include a smart shield system that shuts off power when the device is jarred, and a temperature monitor system that shuts down the device before the temperature gets too high. Additionally, the device is designed to detect foreign objects and automatically shut down to protect the device from damage. K&S IConn ProCu Plus also features a user-friendly color touch-screen for user control. This makes it easy to adjust the device's settings and view status information. It also has Ethernet connectivity for remote monitoring and control, as well as a removable data storage module. This allows users to store and access recipes, as well as back-up and restore data. IConn ProCu Plus is a rugged, reliable and versatile bonder that is capable of providing high-precision results while ensuring minimal costs and downtime. It is an ideal investment for production-level device assembly applications.