Used K&S IConn ProCu #9263233 for sale

K&S IConn ProCu is a thoroughly automated bonder designed to meet a range of thermal, electrical and optical applications. It is an advanced low-temperature thermal imaging equipment for the research and development of leads at the circuit level. The system is capable of performing intricate bonding and joining operations with precision and efficiency, making it ideal for use in a variety of industrial and lab settings. IConn ProCu uses a heated bonding head with adjustable temperature settings to create sturdy, reliable and robust bonds between two surfaces or micro-scale components such as PCBs and electronic components. The unit includes a high-resolution camera to help improve accuracy and repeatability when forming connections. This makes the machine suitable for both prototype and production-style co-operative workflows. The contact bonding head is responsive to the most demanding engineering specifications for bond strength, melting points and peak temperatures. The machine offers rapid cycle time and high-resolution image alignment when combined with other machines like optical inspection or pneumatic presses. It works with fast imaging technology to speed up the bonding process and reduce operator fatigue. The machine includes a variety of applications like soldering, heat-staking and riveting capabilities, available in custom configurations to meet any manufacturing needs. The installed software offers graphical user interface (GUI), display updatable software in order to maintain appropriate operation and session control effectively. In addition, the machine features an automated temperature control unit (ATCU) for accurate repeatability and better control of thermal processes during the manufacturing process. The tool also includes an integrated waste management asset to manage and analyse residue. K&S IConn ProCu is developed to meet the most rigorous industrial requirements. It offers a powerful solution to perform low-temperature bonding operations quickly and accurately. The machine ensures precise bonding and connection process without any defects or delays. Its fast cycle times and low warm-up period makes it suitable for mass production environments as well as providing economical solution for high-end applications. The model is designed for easy assembly, maintenance and trouble-free operation.