Used K&S IConn #293639129 for sale

K&S IConn
Manufacturer
K&S
Model
IConn
ID: 293639129
Vintage: 2013
Wire bonders 2013 vintage.
K&S IConn is a one-and-done bonding solution designed to simplify the complexity of potting and encapsulation processes. It is a fully automated, self-contained assembly system capable of creating a permanent bond between a substrate and a connector, no matter what shape or size the components may be. IConn involves a number of steps that ensure a reliable, repeatable, and permanent bond. The first step is the priming of the substrate. This ensures a strong bond between the substrate and the epoxy that is applied in the second step. Once the substrate has been primed, a selectable amount of epoxy is dispensed over the substrate. The epoxy is a two-component thermoplastic material that has a wide range of flexibility and strength, allowing for maximum stabilization in the bond. The epoxy is also capable of rapid cure times, which contribute to the overall efficiency of the process. The third step is the placement of the connector onto the substrate. The connector placement is critical to the quality and performance of the bond, so K&S IConn ensures that it is carefully put in place, before being sealed by the fourth step. This is done with a custom integrated heated platen that conforms to the shape of the connector and the substrate, achieving maximum contact between them. The fifth step is the application of heat and pressure to the sealed substrate and connector. This ensures that the bond formed is strong and secure - the entire process is carried out in a uniform and consistent manner. Finally, a chemical accelerant is applied in order to ensure the rapid curing of the polymers used in the bonding process. The entire process is designed to be efficient and reliable, and saves time and money compared to manual designs. All components used in the process are of the highest quality and exceed industry standards for quality assurance measures. As a result, IConn is the perfect solution for companies in need of an automated bonding solution to simplify their potting and encapsulation processes.
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