Used K&S IConn #9212960 for sale

K&S IConn is an advanced single-sided bonder from K&S Technologies. It's designed for fast, accurate circuit board assembly of small and medium scale projects. The single-sided bonder is capable of bonding thin-film, flex and flex/rigid materials, as well as conventional rigid substrates. It's fully adjustable and features an easy-to-use interface. The machine provides repeatability and stability to the bond process, enabling production of high-quality boards with minimal operator input. IConn is equipped with precision controls for accurate temperatures, standoff heights and pre-heating time. It also has an advanced camera equipment that scans the substrate to accurately position the die before bonding. K&S IConn uses advanced, computer-controlled bonding equipment including digital oscilloscope, solder nozzle, tweezers, vision system, heaters, force sensors and PCB aligners. This improves the accuracy and reliability of the bond when operating at different heights and temperatures and ensures consistent and reliable bonds. The unit is capable of working on a variety of materials up to 5mm thick. IConn has a high speed, high-resolution optical vision machine that permits recognition and placement of features down to 0.01 micron accuracy. It can also detect PCB flaws and detect and measure standoff height. The nozzle follows two positioning axis for accurate placement and application of solder material. It also has the capability to selectively place solder or flux with precision accuracy on different substrates. The simple, user-friendly machine interface allows fast setup time and short learning curve for the operator. K&S IConn also boasts of a wide range of user selectable process parameters and presets, enabling quick and easy process optimization without increasing setup time. Additionally, it offers advanced password protection, device connection, and audit trail data logging capabilities for operation security. In short, the K &S IConn single-sided bonder is an ideal solution for high volume, small and medium scale circuit board assembly operations where accuracy, repeatability, and reliability are paramount.