Used K&S IConn #9235824 for sale

K&S IConn
Manufacturer
K&S
Model
IConn
ID: 9235824
Wafer Size: 12"
Vintage: 2009
Wire bonders, 12" 2009 vintage.
K&S IConn is a bonder that is designed for making interconnections among all kinds of materials, including metal, plastic, and ceramic-based components for semiconductor packaging. It is designed to provide superior processing capabilities and high bonding strength, and is able to bond with aluminum, copper, and specialty alloys without any mechanical fixing. This bonder is composed of a heated head, a heated platform, and a chamber. The heated head is utilized to heat and bond the materials through evaporation and condensation, while the heated platform allows the materials to be placed and moved into the bonding position. The chamber is designed to contain vapors and gases for heat transfer between the materials. The heated head is capable of melting and reflowing materials at temperatures of up to 1100 degrees Celsius, depending on the materials used. The bonder utilizes a thermosonically-controlled air management system, which is designed to reduce the effects of thermal shock and help maintain the bond strength. It also features a digital display monitor, which allows for easy and precise control of the operating parameters. In addition, IConn Bonding Head is capable of creating a bond line width from 0.1 mm to 0.9 mm, as well as providing minimum height and width on the pattern being bonded. It is also highly resistant to vibration and shock, making it well-suited for applications that require flexibility in terms of mounting and movement. K&S IConn Bonding System also comes with a low-cost and high-performance laser ablation attachment. This attachment is able to quickly and accurately mark and/or trim small areas, allowing the user to remove microdefects that may cause cracking or breakage. Overall, IConn Bonder is designed to provide reliable and high-quality connections, with a wide range of compatibility and features. It is suitable for a variety of industry sectors, making it an excellent alternative to traditional joining and bonding methods.
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