Used K&S IConn #9284584 for sale

K&S IConn is a bonding tool used to create permanent electrical and mechanical connections. The system is designed to quickly and precisely bond wire, cable, ribbon, and small components on all kinds of substrates, as well as providing superior reliability and a long operational life. Utilising advanced innovative technology, IConn provides the highest performance when compared to alternative bonding methods, such as soldering. The tool consists of two halves, the stationary and the moving part. The stationary part contains a number of electrodes which are linked to the power supply, allowing a stable connection during bonding. It also includes a heating element to heat the substrate to optimal temperature prior to bonding. The moving part consists of a clamp, which is equipped with a dedicated power supply and a controlled heating element. This part is adjusted to the desired parameters manually and operated at a predetermined speed. K&S IConn uses a static bonding technology to quickly and accurately bond components and/or wires onto the substrate. The technology involves mechanically moving the pieces into contact, affixing them at an optimal temperature and pressure, while precluding any arcing or bridging of conductive components or wires on the substrate. This enables IConn to achieve superior performance and reliability over alternative methods of bonding. K&S IConn features an intuitive user interface, enabling an operator to quickly and easily set up and control the device. It has a selection of modes to ensure an optimal bonding process is achieved, including a optimisation mode which automatically adjusts the parameters to provide the best result for current parameters. Through the user interface, an operator can select the type of substrate, the size/thickness of the pieces to be bonded, the desired bond force, current-temperature profile, and the quantity of bonds that need to be made. IConn systems are available in a range of sizes to suit a variety of applications. It is recommended for applications where fast and reliable bonding is required, such as automotive, electronics, telecoms, machine building and aviation.