Used K&S iStack #9394665 for sale

K&S iStack is a bonder designed for the unique needs of the semiconductor industry. IStack is a versatile and powerful bonding tool for creating intricate 3D integrated devices utilizing ICs, MCUs, Memories, Capacitors, and other components. It is capable of performing both wire-bond and flip-chip designs. K&S iStack is a fully automated machine that is capable of high-speed processing and assembly with a maximum wire-bond rate of 60,000 wires per hour. IStack allows for precise and accurate bonding of components and connections through its multiple vision systems and its 0.5 µm resolution. It uses a patented, continuous-indexer-base drive method that allows for low-stress bonding and offers an increased speed to market. K&S iStack also offers a wide variety of bond options, including ball, wedge, stitch, and tape-automated bonding (TAB). These different bonding techniques allow for advanced applications such as thick-film, flip-chip, and multi-layer bonding. IStack provides high-precision alignment capabilities for visually restricted bonds and offers a 0.5 µm high-accuracy alignment system that is essential for fine pitch devices. K&S iStack is feature rich, offering sensors and up to 8 segments of bond length programming. This provides users with the ability to customize and fine-tune their designs to meet the requirements of their application. Additionally, its wafer-level network connection allows for easy integration with outside systems such as programmable logic controllers (PLCs) and remote operation systems. Overall, iStack is a powerful and precise bonding tool that provides high speed and quality bonding, while offering users a wide variety of choices when creating intricate 3D integrated devices. Its various bond options and ability to be easily connected to external systems makes this an ideal choice for semiconductor and related industries.