Used K&S Maxum Plus #9162185 for sale

K&S Maxum Plus is a bonder designed for specific bond assembly applications, such as chip-to-chip, die-to-die, or die-to-substrate. The device is designed with sophisticated bonding technology that enables reliable, low-cost assembly with seamless throughput. Maxum Plus features a high-speed, low-power, temperature-controlled bonding head. This allows precise temperature and pressure control to provide optimal bonds with a wide variety of materials. The device has a built-in heater that allows quick heating up to 500°C and a built-in laser for welding applications. The pressure profiling capabilities of the device enable fast optimization of bond profiles. The device includes a control system which can be programmed to set unlimited parameters and control profiles. The system offers automatic time and temperature control, and is capable of adjusting the appropriate parameters for assembly of different materials on demand. K&S Maxum Plus is fitted with a high-resolution camera and image analysis tools to provide accurate positioning of each individual die. This improves the precision of bonding results by optimized die-to-die distance, material compatibility, and adhesive-to-die bonding surface. It also provides precise alignment of die to substrate, including printed circuit boards (PCBs) and ceramic substrates. The device has an easy-to-use graphic user interface which simplifies setup and operation. It also features a compact design with built-in semi-auto correction function to allow easy setup and adjustment of bond parameters. In short, Maxum Plus is a bonder that provides a complete, effective, and flexible tool for automated chip to chip and die to die assembly processes. Its sophisticated and versatile features enable precise and reliable bonding of different materials. The device provides precise control of time, temperature, and pressure for optimal bonding results. The high-quality camera and image analysis feature further improves precision for accurate die-to-die and die-to-substrate bonding results. Moreover, the user-friendly software and simple set-up procedure make it a perfect fit for automated assembly lines.