Used K&S Maxum Plus #9238860 for sale

K&S Maxum Plus is a versatile high speed bonder designed for a wide range of applications in the assembly and semiconductor industries. The equipment is equipped with a fully automated bond head, which is capable of multiple bonding processes including thermal compression bonding, ultrasonic bonding and laser bonding. The bonder is highly accurate and able to precisely control the placement and bonding time often required in demanding wafer level packaging applications. The bond head of Maxum Plus is optimized for high throughput and enables superior yield and bond quality. It features an advanced vision system and the latest Bond Head Motion Control (BHMC) technology, which ensures smooth, rapid tool movement and precision accuracy. The bond head has a wide range of motion including linear, rotary, tilt, and height adjustment, which can be programmed for different job processes. K&S Maxum Plus also features a number of safety features designed to protect users and components from damage. The bond head has an interlock to prevent accidental movement while the unit is in operation and an emergency air release valve that allows quick and efficient release of air pressure during tool movement. The machine is also equipped with a thermocouple sensor to monitor the temperature of the bond head and ensure accurate temperature control. The tool is housed in a rugged and ergonomic enclosure that is optimized for space saving and ease of maintenance. It provides user-friendly access to the control panel and a clear view of the process chamber. Maxum Plus also has an integrated user interface that allows operators to easily configure and monitor the asset. K&S Maxum Plus is an ideal choice for high throughput assembly and wafer level packaging applications. Its advanced capabilities, fast and accurate performance, and user-friendly design make it suitable for various industries such as the medical, aerospace, and electronics.