Used K&S WaferPro+ #9209506 for sale

K&S WaferPro+ is an industry-leading dedicated die bonder designed for high-precision and high-reliability die-to-package bonding on wafer, CSP, and PCB substrates. The machine is loaded with mechanical, electrical, thermal, and optical components. It provides high-speed capability, static accuracy, dual-head systems, and advanced optics. The machine is equipped with K&S patented Micro Automatic Precision and Loader System (MAPLS), which allows for ultra-precise die placement, even on smaller, complex components. This system also provides precision on-the-fly wafer edge-recognition to automatically detect defects down to the 10-micron range. Its dual-head system enables simultaneous bonding operations, allowing for a wider variety of production requirements. Additionally, the machine comes geared with professional-grade optics, such as Telecentric Zoom 3-Power for image capture and inspection. This allows for high-resolution optical images and extreme accuracy for die placement and inspection. Moreover, WaferPro+ is driven by robust controls and flexible software for easy operation. This includes machine and process wizards, powder managers, and programmable logic controllers (PLCs) for die placement detection, inspection, and failure analysis. The machine is also managed by an intuitive operator interface and it comes with numerous process recipes and an offline programming language for customized programming. K&S WaferPro+ is the perfect solution for high-volume bonding operations in the electronics manufacturing industry. Thanks to its advanced technologies and features, the machine can handle a wide variety of application and can meet the needs of both experienced professionals as well as those just starting out in the industry.