Used KAIJO FB 118 #9048249 for sale

KAIJO FB 118 is a fully automatic electrically-actuated semiconductor die bonder used for semiconductor die placement and bonding operations. It offers superior performance in a small footprint, making it suitable for a wide range of production lines. FB 118 is designed with a compact body and a highly efficient two-axes X-Y drive equipment that allows for precise, high speed movement. The machine has a maximum acceleration of over 30G and a travel speed of up to 50mm/sec. It is capable of accurately placing and bonding up to 300,000 semiconductor chips per hour, with a placement location accuracy of ±5µm. KAIJO FB 118 uses advanced vacuum placement technology, with an ultrafast placement time of less than 0.4 seconds. The machine's 6-nozzle placement system delivers the best performance for low-fatigue and high-precision placement of semiconductor dies and chips. With an integrated die bonder, the machine can also bond wafers onto substrates with consistent force and accuracy, enabling reliable processes and high yields. To ensure accuracy, process stability and safety, FB 118 uses an advanced vision unit to recognize the position and size of parts, as well as a comprehensive fail-proof machine to respond quickly to process errors or malfunctions. The machine also supports Ethernet communication and remote maintenance, providing greater flexibility in process control. KAIJO FB 118 is simple and efficient to use, offering complete functionality for semiconductor die placement and bonding operations. Its combination of accuracy, performance and reliability makes it perfect for high-end semiconductor production processes.