Used KAIJO FB 118A #9144975 for sale

KAIJO FB-118A bonder is a top-of-the-line equipment designed for precision bonding operations on a variety of substrates. This high-precision system is utilized in both electronics assembly and semiconductor packaging. FB-118A is unique in its ability to produce fine-pitch PLCC, Fine Pitch Ball Grid Array, and TAB substrates. It also allows for manual adjustments for the angle, bonding force, time, control, and speed, providing an incredibly precise result. KAIJO FB-118A is an advanced computer-controlled bonder, equipped with a powerful microprocessor, graphic display, and a touch-screen interface easy to use for all levels of users. It features an innovative constant-power-flow unit which automatically adjusts and monitors the wire bonder power, creating excellent bonding precision. The bonder is also equipped with a patented auto-focus feature that automatically recalibrates in the event of a wire-bond displacement, providing an extra layer of accuracy. In addition, this model includes a specialty nozzle imported from Japan which is designed to reduce the angle of the wire-bond at the very beginning, allowing for precise placement. FB-118A also includes an intuitive vision machine to detect and inspect the bond of the wire. This tool features multiple waveform options to allow the user to customize their settings and achieve an optimal result. The bonder is also resistant against static electricity, providing a safer and more reliable bonding experience. In summary, KAIJO FB-118A bonder is a top-of-the-line asset designed for precise bonding operations, offering advanced features such as a powerful microprocessor, touch-screen interface, auto-focus, and intuitive vision model. This equipment is ideal for creating fine-pitch PLCC, Fine Pitch Ball Grid Array, and TAB substrates, with adjustable settings for angle, bonding force, time, control, and speed. With its wide variety of features, FB-118A is the perfect choice for any application requiring precision bonding.