Used KAIJO FB 118A #9276592 for sale

KAIJO FB 118A is a high-precision, thermocompression bonder, designed for precise bonding applications in the semiconductor, automotive, telecommunications and medical device industries. It features a large active area with a 17mm heated bonding platform, as well as a flexible feeder system allowing for seamless placement of parts. FB 118A is equipped with a powerful motorized XYZ stage for accurate and repeatable part placement and bonding. KAIJO FB 118A features a unique heater design that is capable of precisely controlling the temperature and time of the heated bonding cycle. The temperature can be precisely set according to the type of material being bonded, allowing for optimal performance for a variety of different materials. With its precise temperature control, FB 118A is ideal for joining semiconductor device wafers, including micro and microbump arrays. KAIJO FB 118A is also equipped with a sophisticated vision system for complete part recognition and placement. This ensures accuracy and repeatability during the bonding operation. A comprehensive library of graphical user interface (GUI) tools is available for creating bond recipes, tracking results and managing the bonder. The combination hardware and software solution ensures repeatable results that meet the highest standards of reliability and productivity. FB 118A is covered by a 3-year manufacturer's warranty and can be integrated with existing standard production lines. In addition, KAIJO offers on-site maintenance, installation, and training services to ensure rapid integration into production. Overall, KAIJO FB 118A is an ideal high-precision bonder for any application requiring tight bonding tolerances and precise control of the bonding parameters. Its combination of precision temperature control, vision-based part recognition, and comprehensive user interface makes it a valuable choice for critical bonding operations in a variety of industries.