Used KAIJO FB 118CH #9268065 for sale

KAIJO FB 118CH is a semi-automated bonder designed specifically for the production of precise, high-performance microelectronic devices. This system is capable of joining gold or aluminum wire to terminals or pads on substrates. This is done by thermo-compression bonding, which requires minimal force and heating. This bonder takes the form of a module connected to a microscope. This micro-bonder consists of an XY z stage for the alignment of metallizations on both substrate and leadframe, a heated mechanical bonding head, and a vacuum nozzle for handling leadframes. In addition, it is equipped with a heating plate, a digital temperature controller, switching circuits, coil and cooling unit, an 8-digit LED display, and a 10-key control panel. FB 118CH bonder precisely lays out the bond lengths with repeatability and accuracy and controls the gold layer thickness and surface finish for consistent results. It also performs low contact resistance thermo-compression (type R or D) with stable current and voltage from thermal energy. This helps to minimize the number of continuous back-and-forth passes, reducing time, cost, and process variations. The bonder's advanced design enables the flexibility to accommodate a variety of lead frames, including those with up to 5 mm pitch. It also offers a high speed, repeatable heated bonding process for high quality and reliability. With its touch screen panel, users can quickly program the machine for specific requirements. KAIJO FB 118CH is compatible with most types of heated tooling and is UL-listed for safety. Its temperature range is 0-250°C with an altitude range of 0-3.6 km. As a result, it is suitable for use in a wide variety of electronics manufacture and assembly environments. Overall, FB 118CH is an ideal solution for high-volume, precision microelectronic device assembly. It is fast, accurate, and reliable, and is designed for use in the most demanding production environments.