Used KAIJO FB 128 #9163766 for sale

KAIJO FB 128 is a fully-automatic programmable fine wire bonder that offers precision and versatility at an affordable price. It is an ideal solution for low- to medium-volume production of fine wire products, such as flip chips, chip-on-boards, optical components, flat-packs, fine pitch ICs and other types of complex semiconductor packages. FB 128 is powered by a servo motor control equipment, which ensures precise bonding control during the wire bonding process. The system is capable of placing wire on a wide range of substrates including copper, aluminum, FR4 and paper boards. The high accuracy achieved by the unit also helps minimize the risk of errors due to misalignment of leads or wires. KAIJO FB 128 also features an integrated vision machine that enables the tool to accurately detect and recognize various types of substrates or wire. This asset reduces time and labor involved in loading and unloading wires and substrates, increasing the efficiency of the production line. The device's programmable wire-bonding pathway enables it to produce any kind of geometry that is required. Up to 128 loops can be automatically programed and operated using the built-in software. FB 128 Wire Bond head can be configured with standard and customized accessories, to enable the production of different types of semiconductor packages, such as ceramic and lead-frame packages. KAIJO FB 128 is equipped with an integrated temperature control model that helps ensure uniform temperature during the bonding process. The temperature levels can be precisely monitored and adjusted to achieve the best results. This reduces wastage and increases process efficiency. FB 128 also features an automatic wire-mapping equipment. This feature enables the user to quickly identify the type and size of wire being used and the number of wires being bonded. This helps in speeding up the production process and eliminates the need for manual counting and labeling of the wires. In addition, a variety of safety features have been built into KAIJO FB 128. These include protection against dust and debris, automatic detection of overloaded substrates, and the ability to detect abnormally high heat generated during the wire-bonding process. All of these features ensure that the device is highly reliable, offering a long-term solution to your bonding needs.