Used KAIJO FB-150D #9266506 for sale

Manufacturer
KAIJO
Model
FB-150D
ID: 9266506
Vintage: 2002
Wire bonder 2002 vintage.
KAIJO FB-150D is an automatic high-precision wire bonder that enables the reliable fabrication of wafer-level assemblies and components required for high-density flexible printed circuits or flat panel displays. It features a hybrid bonding head for simultaneous ball and wedge bonding, as well as an improved bonding head motor for high-speed, stable bonding. In addition, FB-150D offers flexible bonding parameters and anatomic image recognition for reliable and optimal bonding. KAIJO FB-150D supports applications such as back-plane, micro-electromechanical systems (MEMS), and optical device and sensor bonding for a variety of end products. It has a wide wire bond range, a 5.7 inch LCD touch panel for controlling all the machine's settings, and a built-in nitrogen bubbling equipment to maintain wafer integrity and reduce wire voids. It also features a high accuracy 6-axis bonder table with backlash prevention and an automatic wire cut after bonding. FB-150D is equipped with both an optoelectronic vision system and an automated ultrasonic bond head to significantly reduce wire scrub and pull tests, improving output rate and quality. Its automated fine-pitch cycling allows for high-volume production of chips as small as 0.6mm and its programmable memory storage feature allows for fast-bonding cycles and repeatable results. In addition, its low thermal pedestal ensures its efficient operation with improved heat transfer to the wafer. To further optimize bonds, KAIJO FB-150D offers real-time image inspection on each bonded chip and real-time bond force control for improved bond integrity. It also includes a 3D automatic alignment unit for time-saving alignment and enhanced accuracy. The machine is also integrated with a number of safety features, such as a breath shield to prevent accidental exposure to fumes and vapors, an alcove prevention machine, and an emergency stop button. In conclusion, FB-150D is a high-precision automated wire bonder designed for reliable production of quality flexible circuits and flat panel displays. It features an improved bonding head, flexible bonding parameters, optoelectronic vision, and a robust safety design to ensure consistent and reliable results. With its built-in features and versatility, KAIJO FB-150D is a great choice for any production application requiring high-precision and repeatable results.
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