Used KAIJO FB-150DGII #9144974 for sale

KAIJO FB-150DGII is a comprehensive bonding tool, designed for a variety of electronic components. This bonder is suitable for electronic mounting and semiconductor adhesion applications. It provides a quick bonding process with a variety of standard and special materials, such as lead and silver. FB-150DGII features an overhead bonding mechanism and is equipped with a 3-axis robotic arm for accurate placement of adhesive material. It has a large and diverse database of materials, allowing it to bond different types of components and materials. KAIJO FB-150DGII utilizes a heating die register and heat press system, enabling it to perform bonding in a short amount of time. It can also be equipped with a special die tailor-made for Small Outline Integrated Circuit (SOIC) bonding. Furthermore, the bonder is equipped with a pressure sensor and vacuum control system, allowing consistent control of the pressure applied to the die and providing uniform bonding conditions. FB-150DGII uses a CCD camera for vision alignment at 1,000 times magnification. It is capable of high-precision, low-stress wiring processes. The bonder also features a high-resolution microscope, which can detect areas that require rework. KAIJO FB-150DGII also features a data analysis program that can measure, store and generate reports on process results, enabling operators to efficiently keep track of product quality. The bonder's high versatility ensures it can be used in various applications. It is easy to operate with a touch panel display and has enhanced safety measures in place. Lastly, the bonder has a very low maintenance cost and is designed for durability, allowing operators to worry less about the bonder's operating conditions and focus their attention on maximum efficiency.