Used KAIJO FB 170LE #120939 for sale

KAIJO FB 170LE is a fully automated bonder specifically designed to provide superb accuracy and repeatability. This bonder is ideal for ultra-precision applications such as producing flip chips and flip chip substrates, as well as ultra-fine pitch bonding and micro bonding of precision components. The bonder is engineered with an integrated camera to ensure pinpoint accuracy of alignment with a guaranteed resolution of 1.6 μm. FB 170LE boasts a wide range of operating parameters, all of which are controllable via a 6-inch touch screen and intuitive user interface. This ensures easy setup and excellent production efficiency. The bond head is designed with a 150 X 150 mm working area and can handle up to 6,000 bonding points. For production efficiency, the bonder is engineered with a highly precise Linear Scale Driving System that enables a maximum speed of 1.2 m/s. This also allows for repeatable accuracy of 0.015mm, which gives KAIJO FB 170LE its powerful precision bonding capability. Additionally, this bonder is designed with a number of additional features to further enhance accuracy and quality, such as an optional vision registration, auto-focus/archiving camera, and an electrically heated nozzle laminator. These features allow for positional and height correction, which is especially useful for bonding substrates with unstable parameters. All of these features combine to make FB 170LE an ideal choice for those who demand reliable and high-precision bonding. This bonder is easy to use and maintain, ensuring maximum productivity and consistent results with every application. As a result, KAIJO FB 170LE provides superior performance at a cost-effective price, making it the perfect choice for any production line.