Used KAIJO FB 700 #9069042 for sale

KAIJO FB 700 Bonder is a parametric, micro-pulse ultrasonically welded, wire and ribbon bonder. This advanced bonding machine is suitable for a wide range of applications, including fine lead, tab, and ribbon bonds for the production of active device packages. Boasting a large working area, KAIJO FB700 Bonders have a wide range of process control capabilities. Additionally, a range of bond force adjustments are available to control the wire bond effect. FB-700 Bonders are widely recognized for their commercial performance, being highly efficient and reliable. FB 700 incorporates state-of-the-art micro-pulse technology that enables the bonder to provide consistent, high-quality results with low wire breakage and an increased bond force. This technology also reduces the amount of stored energy, further increasing the quality of the bond. FB700 Bonders feature heated wire strippers and a range of heated process heads for controlling the temperature of the bond head. The bonders also feature in-line monitor displays, giving the operator instant feedback on wire-pulse monitoring and wire-bond parameters. KAIJO FB-700 Bonders allow the operator to adjust parameters such as wire length and ball size, as well as providing process parameter tracking capabilities. KAIJO FB 700 Bonders offer improved capabilities with the ability to perform a variety of bonding processes such as: resistance welding, ball bonding, wedge bonding, aluminum wire bonding and spot welding among others. Furthermore, KAIJO FB700 Bonders are also capable of producing multi-layer assemblies and bonding intricate substrates due to the advanced programming options. The bonders also feature elaborate restraint designs, which make them well-suited for high-precision bonding applications. FB-700 Bonders provide highly efficient, dependable and versatile bond results with their technologically advanced features. FB 700 Bonders are ideal for a diverse range of microelectronics and optoelectronic applications that require precision bond results.