Used KAIJO FB 780 #9069043 for sale

KAIJO FB 780 is the latest in semiconductor equipment bonding technology. This machine utilizes advanced directional bonding technology to make extremely tight joins between two or more components. KAIJO FB-780 is a versatile tool that can be used in a variety of applications from precision assembly in the semiconductor industry to large-scale production of consumer electronic items. FB 780 features an intuitive touch-screen interface for easy operation. The machine is designed to bond multiple types of materials ranging from ceramic material to packaged silicon. FB-780 also includes a wide variety of bonding options, from reflowed soldering and reflowed adhesive bonding to thermocompression. This machine is compatible with all types of capillaries and wafer carriers to ensure optimal performance. KAIJO FB 780 offers superior temperature control and higher uniformity than other models in its class. Its upper and lower temperature settings can be adjusted to any desired level from -40˚C to +200˚C, providing greater flexibility of operation. It is also designed to handle large throughput, completing up to 4,000 bonds per hour. KAIJO FB-780 comes with an improved cooling system for rapid heat dissipation during soldering or bonding operations. This ensures a long working life and consistent performance. The vacuum suction feature also ensures greater accuracy during bonding. Additionally, FB 780 has advanced safety features such as an air gap that protects the operator from harmful particle emissions while maintaining ESD control. FB-780 is designed to enhance the quality and reliability of your components. With its advanced thermal and vacuum features, it provides a higher level of performance and safety to ensure the durability of your products. This efficient, easy-to-use machine ensures maximum process accuracy and highest yields.